Indian semiconductor ecosystem: News, Updates & Discussions.

Chhattisgarh to get semiconductor plant; GaN chips to power 5G, 6G from Nava Raipur

PTI
Last Updated: Apr 10, 2025, 07:35:00 PM IST

Synopsis
The chips produced at the factory will just not power everyday devices, they will fuel the future, enabling next gen 5G and 6G networks, high-performance laptops, defence technologies, data analytics, and cutting-edge power electronics.​
1744385482071.png

Chhattisgarh Chief Minister Vishnu Deo Sai will lay the foundation stone for the country's first Gallium Nitride (GaN)-based semiconductor manufacturing unit in Nava Raipur on April 11. With an investment of Rs 1,143 crore, the project will place Chhattisgarh at the forefront of the global semiconductor industry, officials said.

The chips produced at the factory will just not power everyday devices, they will fuel the future, enabling next gen 5G and 6G networks, high-performance laptops, defence technologies, data analytics, and cutting-edge power electronics.

The state-of-the-art facility will be developed by Chennai-based Polymatech Electronics, with an ambitious production target of 10 billion chips annually by 2030. The plant's establishment marks a crucial step in India's drive to reduce its dependency on semiconductor imports and bolster its position as a global tech powerhouse.

Speaking on the development, Rajat Kumar, Secretary, Chhattisgarh Commerce and Industry Department, said, "This partnership with Polymatech will transform Chhattisgarh into a global hub for tech innovation. Investor-friendly policies, world-class infrastructure, and fast-track decision-making are turning this vision into reality".

Calling it a historic milestone for Chhattisgarh, Sai said, "Chhattisgarh is now poised to shine on the semiconductor map. This project is a major stride towards fulfilling the vision of Make in India and Digital India".

Globally, Gallium Nitride (GaN) is being seen as a game-changer in the semiconductor world. GaN chips are faster, more energy-efficient, and highly durable, making them the ideal choice for next-gen technologies.

Chhattisgarh to get semiconductor plant; GaN chips to power 5G, 6G from Nava Raipur
 
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India developing 25 chipsets with indigenous intellectual property: Ashwini Vaishnaw

Twenty chips developed by students will soon be taped out at the Semiconductor Laboratory in Mohali, boosting confidence and paving the way for 85,000 skilled engineers over the next decade.

Moneycontrol
April 12, 2025 / 13:33 IST
1744569588112.png
Vaishnaw noted that 13 projects are currently underway, led by the Centre for Development of Advanced Computing (C-DAC), Bengaluru.

India is developing 25 chipsets with indigenous intellectual property (IP), particularly in high-risk areas like surveillance and Wi-Fi access, under the Design-Linked Incentive (DLI) scheme, Union Minister Ashwini Vaishnaw has stated.

Vaishnaw, in a recent interview with Business Standard, noted that 13 projects are currently underway, led by the Centre for Development of Advanced Computing (C-DAC), Bengaluru. “Owning IP ensures security and transforms us from a services nation to a product nation,” he said, further adding that the upcoming semiconductor fabs will manufacture these chips locally.

Moreover, the minister stated that the government has supported 240 educational institutions with world-class chip design tools to foster talent. Twenty chips developed by students will soon be taped out at the Semiconductor Laboratory in Mohali, boosting confidence and paving the way for 85,000 skilled engineers over the next decade.

Additionally, Vaishnaw revealed that the newly launched Production-Linked Incentive (PLI) scheme for electronic components is set to double value addition within five years. Electronics production has grown fivefold and exports sixfold over the past decade, driven by the PLI, which has also generated 2.5 million jobs.

He also mentioned that India is shifting from import substitution to export-led growth in electronics. “Make in India, make for the world,” Vaishnaw underlined, as efforts continue to integrate with global supply chains.

Responding to concerns over the Digital Personal Data Protection (DPDP) Act, Vaishnaw assured that it aligns with the RTI Act and Supreme Court rulings. “Public-interest data will remain accessible,” he said.

https://www.moneycontrol.com/news/i...ctual-property-ashwini-vaishnaw-12992468.html
 
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Indigenous high-power microwave transistors

CeNSE-revised-image-2.jpg
Image: Sagun Shekar

Most gallium nitride (GaN) microwave transistors are import-restricted because these are highly strategic in nature and are used in radars, jammers, electronic warfare and even telecom infrastructure. These transistors amplify or boost the radio waves when sent from the transmitter in most wireless communication or military applications.

Almost all such GaN transistors are realised on the rather expensive silicon carbide (SiC) platform; developing these devices on GaN on silicon platform is promising for economy of scale and volume. However, such an approach has its own set of challenges.

In new work, for the first time in India, researchers at the Centre for Nano Science and Engineering (CeNSE) have developed and demonstrated a fully indigenous GaN on silicon microwave transistor wherein the material stack or the wafer is grown at IISc, and the transistors are fully designed, fabricated and tested at IISc. The team has achieved a power of 8W at a frequency of 10 GHz, which is of strategic interest. For this, the atomic layer-by-layer deposition of the material stack was carefully studied and optimized and the know-how of fabrication of various unit process modules was developed.

The researchers engineered the energy landscape of the material-stack by tuning a fundamental property of GaN, called ‘polarization’. This helped them get rid of intentional impurities such as carbon or iron that are otherwise mandatory to be added in such wafers to make them withstand high voltages.

For the first time, the team has demonstrated microwave power transistors based on GaN-on-silicon which do not contain any intentional carbon or iron impurities.

CeNSE-revised-image1.jpg
From left to right: Hareesh Chandrashekar, Roopa Jayaramaiah, Digbijoy Nath, Shonkho Shuvro, Aniruddhan Gowrisankar, Srinivasan Raghavan, Prosenjit Sen (Photo: Sagun Shekar)

REFERENCE: Shuvro S, Gowrisankar A, Jayaramaiah R, Venugopalrao A, Chandrasekar H, Sen P, Muralidharan R, 8 W at 10 GHz in AlGaN/GaN High Electron Mobility Transistors on Silicon Without Any Carbon or Iron Doping, Physica Status Solidi RRL (2025) https://onlinelibrary.wiley.com/doi/abs/10.1002/pssr.202400409

Indian Institute of Science

Simply put they CeNSE has built domestic fabrication capability of 8W GaN HEMT on Si. The HEMT has a 10GHz which is X-band so military targeting radars/seekers can use these. 8W is still low power for large radars, so this HEMT can be used in seekers only. The fabrication was done on a domestically developed 220 nm node. Further improvements are expected as the Si substrate in thinned & thermal management is improved.
 
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Suchi Semicon Ships First Semiconductor Chip to U.S. Client

17/04/2025
1744953914379.png

Gujarat-based Suchi Semicon has sent its first packaged semiconductor chip to a U.S.-based consumer electronics company for testing and approval, founder Ashok Mehta confirmed. Commercial production is expected to begin by late April, with the company targeting an annual revenue of ₹75–80 crore by the end of the year.

“This is our first shipment to the U.S. for qualification and testing. We’re working with two clients there, and once the chip is approved, we’ll begin production. The testing process should take about two weeks, and we expect to start manufacturing within three to four weeks,” Mehta said.

SuchiSemicon launched its Outsourced Semiconductor Assembly and Test (OSAT) plant in Surat in December 2024, backed by an initial investment of ₹870 crore. Before entering the semiconductor space, the Suchi Group was known for running one of the country’s largest textile embroidery units.

Co-founder Shetal Mehta said the company’s transition from textiles to semiconductors raised eyebrows, but the move was driven by opportunity. “When we began exploring new areas, semiconductors stood out. India still imports 99% of its semiconductor devices. We saw a clear gap in local production and decided to address it by entering a high-growth sector.”

The Surat plant is fully operational, with equipment installed, trial runs completed, and trained personnel ready. It currently has the capacity to produce 1.5 lakh chips daily, with expansion plans targeting up to 3 million chips per day within three to five years. “Our current setup can handle orders from our two initial clients. As we grow, we’ll bring more customers on board,” said Ashok Mehta.


The company has applied for incentives under the central government’s Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS), but did not wait for approval to start production. Support from the Gujarat government, including a 20% subsidy on infrastructure and machinery costs, has helped ease the initial investment burden, the founders noted.

Suchi Semicon Ships First Semiconductor Chip to U.S. Client | Machine Maker - Latest Manufacturing News | Indian Manufacturing News - Latest Manufacturing News | Indian Manufacturing News - Machine Maker
 
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Potentially game changing opportunity. Hope GoI doesn't screw this up.

Indian scientists propose to develop world's smallest chip using new material

The smallest chip currently in production is the 3-nanometer node, manufactured by companies like Samsung and MediaTek.

By PTI
Last Updated: 20 April 2025, 16:04 IST
1745164288538.png
Image for representation

New Delhi: A team of 30 scientists from India's premier institute, the Indian Institute of Science (IISc), has submitted a proposal to the government to develop 'angstrom-scale' chips, far smaller than the smallest chips currently in production.

The team has submitted the proposal to the government for developing technologies using a new class of semiconductor materials, called 2D Materials, that could enable chip sizes as small as one-tenth of the smallest chips currently in global production and develop India's leadership in semiconductors.

Currently, semiconductor manufacturing is dominated by silicon-based technologies, led by advanced nations such as the US, Japan, South Korea, and Taiwan.

"A team of scientists at IISc submitted a detailed project report (DPR) to the Principal Scientific Adviser (PSA) in April 2022, which was revised and submitted again in October 2024. The report was later shared with the Ministry of Electronics and IT. The project promises to develop angstrom-scale chips, far smaller than the smallest chips in production today," a source in the government familiar with the proposal told PTI.

The DPR proposes the development of 2D semiconductors using ultra-thin materials like graphene and transition metal dichalcogenides (TMDs). These materials can enable chip fabrication at the angstrom scale, significantly smaller than current nanometer-scale technologies.

The smallest chip currently in production is the 3-nanometer node, manufactured by companies like Samsung and MediaTek.

A brief summary of the 2D materials project -- which aims to replace silicon, is available on the website of the PSA's office. Sources in the Ministry of Electronics and IT (MeitY) confirmed that the proposal has been under discussion.

"MeitY is positive about the project. The Principal Scientific Adviser and Secretary, MeitY, have held meetings on it. MeitY is exploring the electronics applications where such technology can be deployed. This is a collaborative effort that requires due diligence at every step," an official aware of the matter said.

India currently relies heavily on foreign players for semiconductor manufacturing -- a technology that is strategic from both an economic and national security standpoint.

The country's largest semiconductor project, being set up by Tata Electronics in partnership with Taiwan's PSMC, involves an investment of Rs 91,000 crore. This project has been approved under the India Semiconductor Mission and is eligible for 50 per cent capital support from the government.

In comparison, the IISc-led proposal requests a relatively modest Rs 500 crore over five years to build indigenous technology for next- generation semiconductors. The project also includes a roadmap for self-sustainability after the initial funding phase.

Globally, 2D materials have drawn significant interest. Europe has invested over USD 1 billion (around Rs 8,300 crore), South Korea over USD 300 million, and countries like China and Japan have made serious but undisclosed investments in 2D material-based semiconductor research.

"2D materials will be key enablers for future heterogeneous systems. While global momentum is building, India's efforts remain limited and need urgent scaling. This is a domain where India can take leadership, but time is running out," said an officer familiar with the efforts and global developments, speaking on condition of anonymity.

According to the PSA office website, communications regarding the project have been ongoing since 2021, with outreach to key ministries including MeitY, DRDO, and the Department of Space. NITI Aayog also recommended the project in September 2022 based on the IISc report.
The officer privy to the research ecosystem noted that several countries are already preparing for a post-silicon world as traditional chip scaling nears its limits.

"Global technology players have turned their attention to 2D semiconductors. India now needs to move from deliberation to execution. The proposal seeks Rs 500 crore over five years, but there is still no formal assurance. This window may not stay open for long," the person added.

India Proposes Angstrom-Scale Chips to Lead Semiconductor Innovation
 
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Gautam said:
Potentially game changing opportunity. Hope GoI doesn't screw this up.

Indian scientists propose to develop world's smallest chip using new material

The smallest chip currently in production is the 3-nanometer node, manufactured by companies like Samsung and MediaTek.

By PTI
Last Updated: 20 April 2025, 16:04 IST
View attachment 42509
Image for representation

New Delhi: A team of 30 scientists from India's premier institute, the Indian Institute of Science (IISc), has submitted a proposal to the government to develop 'angstrom-scale' chips, far smaller than the smallest chips currently in production.

The team has submitted the proposal to the government for developing technologies using a new class of semiconductor materials, called 2D Materials, that could enable chip sizes as small as one-tenth of the smallest chips currently in global production and develop India's leadership in semiconductors.

Currently, semiconductor manufacturing is dominated by silicon-based technologies, led by advanced nations such as the US, Japan, South Korea, and Taiwan.

"A team of scientists at IISc submitted a detailed project report (DPR) to the Principal Scientific Adviser (PSA) in April 2022, which was revised and submitted again in October 2024. The report was later shared with the Ministry of Electronics and IT. The project promises to develop angstrom-scale chips, far smaller than the smallest chips in production today," a source in the government familiar with the proposal told PTI.

The DPR proposes the development of 2D semiconductors using ultra-thin materials like graphene and transition metal dichalcogenides (TMDs). These materials can enable chip fabrication at the angstrom scale, significantly smaller than current nanometer-scale technologies.

The smallest chip currently in production is the 3-nanometer node, manufactured by companies like Samsung and MediaTek.

A brief summary of the 2D materials project -- which aims to replace silicon, is available on the website of the PSA's office. Sources in the Ministry of Electronics and IT (MeitY) confirmed that the proposal has been under discussion.

"MeitY is positive about the project. The Principal Scientific Adviser and Secretary, MeitY, have held meetings on it. MeitY is exploring the electronics applications where such technology can be deployed. This is a collaborative effort that requires due diligence at every step," an official aware of the matter said.

India currently relies heavily on foreign players for semiconductor manufacturing -- a technology that is strategic from both an economic and national security standpoint.

The country's largest semiconductor project, being set up by Tata Electronics in partnership with Taiwan's PSMC, involves an investment of Rs 91,000 crore. This project has been approved under the India Semiconductor Mission and is eligible for 50 per cent capital support from the government.

In comparison, the IISc-led proposal requests a relatively modest Rs 500 crore over five years to build indigenous technology for next- generation semiconductors. The project also includes a roadmap for self-sustainability after the initial funding phase.

Globally, 2D materials have drawn significant interest. Europe has invested over USD 1 billion (around Rs 8,300 crore), South Korea over USD 300 million, and countries like China and Japan have made serious but undisclosed investments in 2D material-based semiconductor research.

"2D materials will be key enablers for future heterogeneous systems. While global momentum is building, India's efforts remain limited and need urgent scaling. This is a domain where India can take leadership, but time is running out," said an officer familiar with the efforts and global developments, speaking on condition of anonymity.

According to the PSA office website, communications regarding the project have been ongoing since 2021, with outreach to key ministries including MeitY, DRDO, and the Department of Space. NITI Aayog also recommended the project in September 2022 based on the IISc report.
The officer privy to the research ecosystem noted that several countries are already preparing for a post-silicon world as traditional chip scaling nears its limits.

"Global technology players have turned their attention to 2D semiconductors. India now needs to move from deliberation to execution. The proposal seeks Rs 500 crore over five years, but there is still no formal assurance. This window may not stay open for long," the person added.

India Proposes Angstrom-Scale Chips to Lead Semiconductor Innovation
Click to expand...
Knowing GOI, they will screw it up
 
Gautam said:
Chhattisgarh to get semiconductor plant; GaN chips to power 5G, 6G from Nava Raipur

PTI
Last Updated: Apr 10, 2025, 07:35:00 PM IST

Synopsis
The chips produced at the factory will just not power everyday devices, they will fuel the future, enabling next gen 5G and 6G networks, high-performance laptops, defence technologies, data analytics, and cutting-edge power electronics.​
View attachment 42224

Chhattisgarh Chief Minister Vishnu Deo Sai will lay the foundation stone for the country's first Gallium Nitride (GaN)-based semiconductor manufacturing unit in Nava Raipur on April 11. With an investment of Rs 1,143 crore, the project will place Chhattisgarh at the forefront of the global semiconductor industry, officials said.

The chips produced at the factory will just not power everyday devices, they will fuel the future, enabling next gen 5G and 6G networks, high-performance laptops, defence technologies, data analytics, and cutting-edge power electronics.

The state-of-the-art facility will be developed by Chennai-based Polymatech Electronics, with an ambitious production target of 10 billion chips annually by 2030. The plant's establishment marks a crucial step in India's drive to reduce its dependency on semiconductor imports and bolster its position as a global tech powerhouse.

Speaking on the development, Rajat Kumar, Secretary, Chhattisgarh Commerce and Industry Department, said, "This partnership with Polymatech will transform Chhattisgarh into a global hub for tech innovation. Investor-friendly policies, world-class infrastructure, and fast-track decision-making are turning this vision into reality".

Calling it a historic milestone for Chhattisgarh, Sai said, "Chhattisgarh is now poised to shine on the semiconductor map. This project is a major stride towards fulfilling the vision of Make in India and Digital India".

Globally, Gallium Nitride (GaN) is being seen as a game-changer in the semiconductor world. GaN chips are faster, more energy-efficient, and highly durable, making them the ideal choice for next-gen technologies.

Chhattisgarh to get semiconductor plant; GaN chips to power 5G, 6G from Nava Raipur
Click to expand...
Isn't there a lab scale GaN facility for defence at Bengaluru? Which was using 14 NM finfet tech?
 
economictimes.indiatimes.com

Cabinet clears Rs 3,706 cr HCL-Foxconn semiconductor plant in UP's Jewar

The Union Cabinet on Wednesday cleared the countrys sixth semiconductor unit—a ₹3,706 crore joint venture between HCL and Foxconn—to be set up in Jewar, Uttar Pradesh. The facility will produce display driver chips for devices such as smartphones, laptops, PCs, and vehicles.
economictimes.indiatimes.com economictimes.indiatimes.com
6th semiconductor plant cleared by CCS .
 
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Indian scientists propose to develop world's smallest chip using new material

By PTI
Last Updated: 20 April 2025, 16:04 IST
1747484730858.png
Representative image.

New Delhi: A team of 30 scientists from India's premier institute, the Indian Institute of Science (IISc), has submitted a proposal to the government to develop 'angstrom-scale' chips, far smaller than the smallest chips currently in production.

The team has submitted the proposal to the government for developing technologies using a new class of semiconductor materials, called 2D Materials, that could enable chip sizes as small as one-tenth of the smallest chips currently in global production and develop India's leadership in semiconductors.

Currently, semiconductor manufacturing is dominated by silicon-based technologies, led by advanced nations such as the US, Japan, South Korea, and Taiwan.

"A team of scientists at IISc submitted a detailed project report (DPR) to the Principal Scientific Adviser (PSA) in April 2022, which was revised and submitted again in October 2024. The report was later shared with the Ministry of Electronics and IT. The project promises to develop angstrom-scale chips, far smaller than the smallest chips in production today," a source in the government familiar with the proposal told PTI.

The DPR proposes the development of 2D semiconductors using ultra-thin materials like graphene and transition metal dichalcogenides (TMDs). These materials can enable chip fabrication at the angstrom scale, significantly smaller than current nanometer-scale technologies.

The smallest chip currently in production is the 3-nanometer node, manufactured by companies like Samsung and MediaTek.

A brief summary of the 2D materials project -- which aims to replace silicon, is available on the website of the PSA's office.

Sources in the Ministry of Electronics and IT (MeitY) confirmed that the proposal has been under discussion.

"MeitY is positive about the project. The Principal Scientific Adviser and Secretary, MeitY, have held meetings on it. MeitY is exploring the electronics applications where such technology can be deployed. This is a collaborative effort that requires due diligence at every step," an official aware of the matter said.

India currently relies heavily on foreign players for semiconductor manufacturing -- a technology that is strategic from both an economic and national security standpoint.

The country's largest semiconductor project, being set up by Tata Electronics in partnership with Taiwan's PSMC, involves an investment of Rs 91,000 crore. This project has been approved under the India Semiconductor Mission and is eligible for 50 per cent capital support from the government.

In comparison, the IISc-led proposal requests a relatively modest Rs 500 crore over five years to build indigenous technology for next- generation semiconductors. The project also includes a roadmap for self-sustainability after the initial funding phase.

Globally, 2D materials have drawn significant interest. Europe has invested over USD 1 billion (around Rs 8,300 crore), South Korea over USD 300 million, and countries like China and Japan have made serious but undisclosed investments in 2D material-based semiconductor research.

"2D materials will be key enablers for future heterogeneous systems. While global momentum is building, India's efforts remain limited and need urgent scaling. This is a domain where India can take leadership, but time is running out," said an officer familiar with the efforts and global developments, speaking on condition of anonymity.

According to the PSA office website, communications regarding the project have been ongoing since 2021, with outreach to key ministries including MeitY, DRDO, and the Department of Space. NITI Aayog also recommended the project in September 2022 based on the IISc report.
The officer privy to the research ecosystem noted that several countries are already preparing for a post-silicon world as traditional chip scaling nears its limits.

"Global technology players have turned their attention to 2D semiconductors. India now needs to move from deliberation to execution. The proposal seeks Rs 500 crore over five years, but there is still no formal assurance. This window may not stay open for long," the person added.

India Proposes Angstrom-Scale Chips to Lead Semiconductor Innovation
 
Asterion Moloc said:

Click to expand...
Still long way to go, we need to build massive capacity for legacy 65-28 nm nodes for commercial and most importantly defence use. Let the Taiwanese and Koreans bleed money for below 10 nm nodes. For India I think up to 28 nm is enough. It's highly unlikely China will ever gain a strong export foothold in the advanced below 10 nm process nodes, but they have a huge capacity for 28 nm to 65 nm chips which is a national security threat. So we must focus our energy towards those mature process nodes.
 
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RationalGuy said:
Still long way to go, we need to build massive capacity for legacy 65-28 nm nodes for commercial and most importantly defence use. Let the Taiwanese and Koreans bleed money for below 10 nm nodes. For India I think up to 28 nm is enough. It's highly unlikely China will ever gain a strong export foothold in the advanced below 10 nm process nodes, but they have a huge capacity for 28 nm to 65 nm chips which is a national security threat. So we must focus our energy towards those mature process nodes.
Click to expand...
It is not either legacy nodes or advanced nodes. We need all the semicon plants we can get.
But there is implicit ban on advanced nodes plant in India (<14nm), which we should be having one way or another to be truly self reliant.
See the reason given by TSMC to India, Qatar etc, when asked to setup advanced node:
TSMC has declined invitations to build fabs in 3 nations, Qatar, Singapore and India, despite strong offers, media report, citing unnamed supply chain sources, who add Qatar has been most aggressive and is considering raising its subsidy offer. Taiwan remains the top fab location for TSMC, with overseas expansion seen as a last resort. The fab projects in the US, Japan and Germany were all driven by pressure as well as the importance of each country in semiconductor equipment, materials, chip design, etc.
Click to expand...
https://twitter.com/x/status/1925067769617490184

See the semicon industry is very large with very niche players from Japan, Germany etc whom whole industry depends for these advanced nodes and TSMC is just a integrator of all these inputs(not discounting them for running a fab, they did good). Even the ASML of Dutch depends on very specific inputs from US and Germany, that is why when US banned ASML from exporting their EUV to China ASML stayed silent because they themselves depend on US tech.
Asterion Moloc said:
Principles according to ASML required to be mastered to produce capable Lithographic machine
www.asml.com

Lithography principles

Learn the basics of semiconductor lithography, the critical step in the microchip manufacturing process.
www.asml.com www.asml.com

Not an Expert in this field, but I would add precise Lenses (for DUV) and Mirrors (for EUV) are also a critical technology for a Lithographic machine required to be mastered and these lenses and mirrors have ISR applications for our own KeyHole series of satellites. BTW US LLNL has helped with the development of EUVL in 1990s by roping in Europeans and Japanese and transferring required IP to them, see pg 13-17 in this PDF:


www.zeiss.com

EUV lithography and technology | ZEISS SMT

The next technological breakthrough for the semiconductor industry: EUV lithography optics from ZEISS SMT for even more powerful microchips. EUV means "extrem ultraviolet light".
www.zeiss.com www.zeiss.com

www.asianometry.com

How Carl Zeiss Crafted a House of Mirrors for EUV Light

Merry Christmas, everyone
www.asianometry.com www.asianometry.com


No wonder the only other near competitors to ASML are both Lense maker themselves Canon, Nikon




I would add EDA softwares also required for Chip Design which are US based, So US still holds many keys to the semiconductor industry not just with market size but also on tech side, which make ASML etc to obey US sanctions as the key tech was funded by US itself.
Click to expand...


Ideally, apart from this push to get fabs we should focus on one particular area of semicon either the design softwares or photoresists or lenses etc. So that we too can integrate in the supply chains globally and become indispensable like how Japan, Germany etc are.
 
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